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| MITSUBISHI LASER DIODES PRELIMINARY Notice: Some parametric limits are subject to change ML9xx37 SERIES High Power InGaAsP DFB LASER DIODE TYPE NAME ML99237/ML9SM37 APPLICATION CW light source for external modulator DESCRIPTION ML9xx37 series are high power DFB (Distributed Feedback) laser diodes for optical transmission emitting light beam at 1550nm. ML9xx37 achieves 60mW CW operation with stable single longitudinal mode oscillation and narrow linewidth. ML9xx37 is a suitable light source for a 10Gbps/40Gbps external modulator. FEATURES High power operation: 60mW (@25 oC ) High side-mode suppression ratio: 45dB (typ) Narrow line width: 0.5MHz (typ) Small size chip-on-carrier ABSOLUTE MAXIMUM RATINGS Symbol Po If VRL Tsld Tc Tstg Parameter Optical output power Laser forward current Laser reverse voltage Soldering temperature Operation temperature Storage temperature Conditions CW 1 minute Ratings 80 45 0 2 320 +15 ~ +35 -40 ~+100 Unit mW mA V o C C C o o ELECTRICAL/OPTICAL CHARACTERISTICS (Tc=25 C) o Symbol Ith Iop Vop Parameter Threshold current Operation current Operating voltage Slope efficiency Peak wavelength Side mode suppression ratio Beam divergence angle (parallel) CW Conditions Min. 0.30 1530 35 - Limits Typ. 20 20 0 1.8 0.35 1550 45 20 25 0.5 - Max . 35 30 0 2.5 1565 40 45 1.0 -145 Unit mA mA V mW/mA nm dB deg. deg. MHz dB/Hz CW,Po=60 mW CW,Po=60 mW CW,Po=60 mW CW,Po=60 mW CW,Po=60 mW CW,Po=60 mW p SMSR f RIN (perpendicular) CW,Po=60 mW Linewidth Relative Intensity Noise CW,Po=60 mW CW,Po=60 mW,0.5~10GHz MITSUBISHI ELECTRIC Feb. 2003 MITSUBISHI LASER DIODES ML9xx37 SERIES High Power InGaAsP DFB LASER DIODE OUTLINE DRAWINGS ML99237 (2) 3.00.1 Beam Point (2) (1) Light output 1.00.1 1.00.1 2.0 2.0 6.00.2 (1) Case ML9SM37 ( 1 ) Anode electrode ( 2 ) Cathode electrode (2) Residual Solder (Au80Sn20) Light output front facet 00.06 (Beam Point) 1.20.06 0.370.05 Au metalized (1) Case * Notification for a submount product The submount product may show the change of the optical and electrical characteristics due to the influences of an assembly substrate (strain, thermal conductivity, etc.) prepared by the customer. Therefore, the supplier is not obliged to guarantee that all optical and electrical characteristics meet specifications after the shipment. MITSUBISHI ELECTRIC Feb. 2003 |
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